US Patent Issued to Applied Materials on July 14 for "Method of forming holes from both sides of substrate" (California Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,165, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method of forming holes from both sides of substrate" was invented by Timothy Joseph Franklin (Campbell, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for forming holes through a substrate are provided herein. In some embodiments, a method of forming holes in a substrate for use in a process chamber includes: partially forming the plurality of holes in a substrate using a first drill to form a plurality of rough holes through the substrate from a first side of the substrate to an opposite second side of the substrate; positioning the ...