US Patent Issued to Applied Materials on July 14 for "Atmospheric pressure plasma for substrate annealing" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,047, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Atmospheric pressure plasma for substrate annealing" was invented by Banqiu Wu (San Jose, Calif.), Khalid Makhamreh (Los Gatos, Calif.) and Eliyahu Shlomo Dagan (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for contacting a substrate with a plasma at a pressure from about 300 Torr to about 1000 Torr for a period of time sufficient to heat a top portion of the substrate having a depth of less than about 200 nm, to a temperature high enough for annealing, and the temperature of the substrate at a depth of greater than or equ...