US Patent Issued to Applied Materials on Feb. 24 for "Profile control during polishing of a stack of adjacent conductive layers" (California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,756, issued on Feb. 24, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Profile control during polishing of a stack of adjacent conductive layers" was invented by Kun Xu (Sunol, Calif.), Harry Q. Lee (Los Altos, Calif.), Benjamin Cherian (San Jose, Calif.) and David Maxwell Gage (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "During polishing of a stack of adjacent conductive layers on a substrate, an in-situ eddy current monitoring system measures sequence of characterizing values. A polishing rate is repeatedly calculated from the sequence of characterizing values repeatedly, one or more adjustments for one or more...