US Patent Issued to Applied Materials on Feb. 24 for "Integrated inspection for enhanced hybrid bonding yield in advanced semiconductor packaging manufacturing" (California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,015, issued on Feb. 24, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Integrated inspection for enhanced hybrid bonding yield in advanced semiconductor packaging manufacturing" was invented by Venkatakaushik Voleti (San Jose, Calif.), Kyle Tantiwong (Livermore, Calif.) and Mehdi Vaez-Iravani (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus of hybrid bonding with inspection are provided herein. In some embodiments, a method of hybrid bonding with inspection includes: cleaning a substrate via a first cleaning chamber and a tape frame having a plurality of chiplets via a second cleaning chamber; i...