US Patent Issued to Applied Materials on Feb. 24 for "Bottom up molybdenum gapfill" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,836, issued on Feb. 24, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Bottom up molybdenum gapfill" was invented by Rand Haddadin (Gilbert, Ariz.) and Kunal Bhatnagar (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure relate to methods for molybdenum gapfill. Additional embodiments provide a method of forming a molybdenum gapfill without substantial voids. Some embodiments of the disclosure are relevant for higher aspect ratio features including DRAM memory cells."

The patent was filed on July 29, 2022, under Application No. 17/877,310.

*For further information, including images, charts a...