US Patent Issued to Applied Materials on Feb. 17 for "Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate" (German Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,124, issued on Feb. 17, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate" was invented by Thomas Werner Zilbauer (Gauting, Germany) and Andreas Lopp (Freigericht, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sputter deposition source for depositing a material on a substrate is described. The sputter deposition source includes an array of magnetron sputter cathodes arranged in a row for coating the substrate in a deposition area on a front side of the array. At least one magnetron sputter cathode of the array includes a f...