US Patent Issued to Applied Materials on Aug. 4 for "Shape thin substrates by curing shrinkable materials deposited with localized variations" (California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,367, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Shape thin substrates by curing shrinkable materials deposited with localized variations" was invented by Yingdong Luo (Newark, Calif.), Xiaopei Deng (San Jose, Calif.), Kang Luo (San Jose, Calif.), Rami Hourani (Santa Clara, Calif.), Daihua Zhang (Los Altos, Calif.) and Ludovic Godet (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of curing a deformation in a substrate are provided. In some embodiments, the method includes identifying one or more areas on the substrate with deformation. The method further includes printing a first film on ...