US Patent Issued to Applied Materials on Aug. 4 for "Power architecture with dual core advance substrate" (American, Indian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,073, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Power architecture with dual core advance substrate" was invented by Mudit Sunilkumar Khasgiwala (Milpitas, Calif.), Subramani Kengeri (Saratoga, Calif.), Meghna Maheshkumar Patel (Navsari, India) and Tameesh Suri (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device may include a printed circuit board. The electronic device may include a first core with a first cavity, the first core formed from an organic material, and the first cavity configured to house a DC capacitor for delivery of direct current to a die from a voltage source. ...