US Patent Issued to APPLIED MATERIALS on Aug. 4 for "Heat shield assemblies for minimizing heat radiation to pump of process chamber" (American, Indian Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,574, issued on Aug. 4, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Heat shield assemblies for minimizing heat radiation to pump of process chamber" was invented by Dinkesh Huderi Somanna (San Jose, Calif.), Ala Moradian (San Jose, Calif.), Colin John Dickinson (San Jose, Calif.) and Manjunath Subbanna (Bengaluru, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of heat shield assemblies for a processing chamber are provided herein. In some embodiments, a heat shield assembly for a processing chamber includes: a first shield comprising a circular plate; a second shield coupled to the first shield and in a parallel co...