US Patent Issued to Applied Materials on Aug. 18 for "Removal of organic material from high aspect ratio structures" (California Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,854, issued on Aug. 18, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Removal of organic material from high aspect ratio structures" was invented by Sonam Dorje Sherpa (Santa Clara, Calif.) and Alok Ranjan (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure include a method of device processing, comprising: exposing a device substrate to a carbon-free fluorine-containing gas for a first period of time, delivering an inert gas to the processing volume for a second period of time; and removing a organic fill material of the device substrate by generating a plasma over the device substrate,...