US Patent Issued to Applied Materials on Aug. 11 for "Semiconductor substrate chucking sensor" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,933, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Semiconductor substrate chucking sensor" was invented by Edward P. Hammond (Hillsborough, Calif.), Tsutomu Tanaka (Santa Clara, Calif.), Alexander V. Garachtchenko (Brentwood, Calif.) and Dmitry A Dzilno (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pedestal may be configured to support a substrate during a semiconductor process. An electrostatic chuck (ESC) may include electrodes embedded in the pedestal that are configured to deliver a chucking voltage to the pedestal during the semiconductor process. A power source coupled to an electrode ...