ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,057, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Method for detection of wafer slippage" was invented by Wei Lu (Fremont, Calif.), Yu-Chi Yeh (Mountain View, Calif.), Kun-Yo Lin (Zhubei, Taiwan), Wade Chung (Hsinchu, Taiwan), Harry Q. Lee (Los Altos, Calif.), Nick Huang (Hsinchu, Taiwan) and Jianshe Tang (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary methods for detecting substrate slippage include sweeping a first sensor and a second sensor of an in-situ monitoring system across the substrate as the substrate undergoes polishing with a rotatable platen. A first sequence of signal val...