US Patent Issued to Applied Materials on Aug. 11 for "Introduction of metal in hard mask for high aspect ratio device patterning" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,911, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Introduction of metal in hard mask for high aspect ratio device patterning" was invented by Han Wang (Palo Alto, Calif.), Chao Li (Santa Clara, Calif.), Yu Yang (Santa Clara, Calif.) and Gene Lee (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for patterning a boron-containing hard mask includes patterning an oxide hard mask formed on a boron-containing hard mask, and patterning the boron-containing hard mask using the patterned oxide hard mask, wherein the oxide hard mask comprises silicon oxide (SiO2), the boron-containing hard mask is ...