US Patent Issued to Applied Materials on April 7 for "Module for flipping substrates in vacuum" (Indian, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,552, issued on April 7, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Module for flipping substrates in vacuum" was invented by Karunakaran Nataraj (Coimbatore, India), Sathiyamurthi Govindasamy (Coimbatore, India), Suresh Palanisamy (Coimbatore, India), Harish V. Penmethsa (Dublin, Calif.) and Naresh Kumar Asokan (Coimbatore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus and methods for flipping substrates in vacuum between PVD sputtering of each side for increasing throughput are provided herein. In some embodiments disclosed herein, a module of a processing system for flipping a substrate in vacuum is provided. T...