US Patent Issued to Applied Materials on April 21 for "Electroplating systems and methods with increased metal ion concentrations" (Montana Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,928, issued on April 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Electroplating systems and methods with increased metal ion concentrations" was invented by Paul R. McHugh (Kalispell, Mont.), Gregory J. Wilson (Kalispell, Mont.), Kwan Wook Roh (Kalispell, Mont.), Kyle M. Hanson (Kalispell, Mont.), Forrest G. Reinhart (Kalispell, Mont.), David J. Reis (Kalispell, Mont.), James E. Brown (Kalispell, Mont.) and Nolan L. Zimmerman (Kalispell, Mont.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present technology include electroplating methods that include providing a first portion of an electrolyte feedstock to...