US Patent Issued to Applied Materials on April 14 for "In situ wafer seal chuck defects identification" (Indian, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,602,771, issued on April 14, was assigned to Applied Materials Inc..

"In situ wafer seal chuck defects identification" was invented by Gangadhar Sheelavant (Guledgudd, India), Karthick Vasu (Arakkonam, India), Prabhugouda Shekharagouda Hiregoudra (Hosahalli, India), Randy A Harris (Kalispell, Mont.) and Aaron Juntunen (Kalispell, Mont.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary wafer seal chuck assembly maintenance chambers may include a chamber body defining an open interior. The chambers may include a plurality of chuck assembly supports disposed within the open interior. The plurality of chuck assembly supports may be rotatable within ...