US Patent Issued to Applied Materials Israel on Nov. 3 for "Algorithm for 3D reconstruction of diagonally cut semiconductor logic structure" (Israeli, Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,364, issued on Nov. 3, was assigned to Applied Materials Israel Ltd. (Rehovot, Israel).

"Algorithm for 3D reconstruction of diagonally cut semiconductor logic structure" was invented by Guy Shwartz (Ramat-Gan, Israel), Ohr Lahad (Rehovot, Israel), Eran Erdal (Messilat Zion, Israel), Ido Almog (Rehovot, Israel), Lior Yaron (Ness Ziona, Israel), Ching-Hung Lai (Hsinchu, Taiwan) and Ron Bar-Or (Ramat-Gan, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for generating a 3D reconstruction of structural elements of a wafer including: obtaining a 2D image of a top view of the plurality of structural elements, sectioned diagonally in a compoun...