US Patent Issued to Apple on Sept. 22 for "Scalable extreme large size substrate integration" (California Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,661, issued on Sept. 22, was assigned to Apple Inc. (Cupertino, Calif.).

"Scalable extreme large size substrate integration" was invented by Kunzhong Hu (Cupertino, Calif.), Chonghua Zhong (Cupertino, Calif.), Jiongxin Lu (Cupertino, Calif.) and Jun Zhai (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electronic packages and methods of formation are described in which an interposer is solderlessly connected with a package substrate. The interposer may be stacked on the package substrate and joined with a conductive film, and may be formed on the package substrate during a reconstitution sequence."

The patent was filed on July 28,...