US Patent Issued to Apple on Sept. 22 for "Chip singulation assisted structures and methods for improving bonding interface quality" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,681, issued on Sept. 22, was assigned to Apple Inc. (Cupertino, Calif.).

"Chip singulation assisted structures and methods for improving bonding interface quality" was invented by Chi Nung Ni (Foster City, Calif.), Wei Chen (San Jose, Calif.), Weiming Chris Chen (Hsinchu City, Taiwan), Vidhya Ramachandran (Cupertino, Calif.), Jie-Hua Zhao (Cupertino, Calif.), Suk-Kyu Ryu (Cupertino, Calif.), Myung Jin Yim (San Jose, Calif.), Chih-Ming Chung (Cupertino, Calif.), Jun Zhai (Cupertino, Calif.), Young Doo Jeon (San Jose, Calif.) and Seungjae Lee (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit (IC) structures, electron...