ALEXANDRIA, Va., July 16 -- United States Patent no. 12,671,448, issued on June 30, was assigned to Apple Inc. (Cupertino, Calif.).
"Multi-band multi-path interconnections" was invented by Sang Hyun Woo (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a first interconnection between a first circuitry and a second circuitry that does not include a switch. A second interconnection may couple or connect third circuitry to the first interconnection via a first switch. Signals sent from the first circuitry to the second circuitry may have a higher priority and/or a different frequency than those sent from the third circuitry to the second circuitry. The first switch may ...