US Patent Issued to Apple on June 16 for "Copper alloy film with high strength and high conductivity" (California, Pennsylvania Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,500, issued on June 16, was assigned to Apple Inc. (Cupertino, Calif.).

"Copper alloy film with high strength and high conductivity" was invented by Herng-Jeng Jou (San Jose, Calif.), Jacob L. Smith (Sunnyvale, Calif.) and Weiming Huang (State College, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu-Ag) with be...