US Patent Issued to Apple on July 14 for "Transfer molding systems for semiconductor device packaging" (California, Arizona Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,696, issued on July 14, was assigned to Apple Inc. (Cupertino, Calif.).

"Transfer molding systems for semiconductor device packaging" was invented by Nitesh Kumbhat (San Jose, Calif.), Yanfeng Chen (San Ramon, Calif.), Mandar S. Painaik (Chandler, Ariz.), Shankar S. Pennathur (San Jose, Calif.) and Pierpaolo Lupo (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includ...