ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,556,866, issued on Feb. 17, was assigned to Apple Inc. (Cupertino, Calif.).
"Audio modules with wire dampeners" was invented by Marco Baratelli (San Francisco), Dinesh Balakrishnan (Monte Sereno, Calif.), Logan A. Rotolo (San Francisco), Pablo Seoane Vieites (Gauting, Germany) and Matthew A. Donarski (San Francisco).
According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of the subject technology provide an acoustic module with a dampening component integrated within the acoustic module to reduce deflection of a wire for a voice coil. The dampening component can take the form of an adhesive or a semisolid. During operation of the audio module, the...