US Patent Issued to Apple on Aug. 4 for "Thermoelectric cooling modules" (California Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,916, issued on Aug. 4, was assigned to Apple Inc. (Cupertino, Calif.).

"Thermoelectric cooling modules" was invented by Miikka M. Kangas (Campbell, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments disclosed herein describe thermoelectric cooling modules. The thermoelectric cooling modules may include a first substrate positioned over a second substrate in a vertical stacking direction, and may include a thermoelectric connector that thermally connects the first and second substrates. The thermoelectric connector may be configured to transfer heat laterally relative to the vertical stacking direction to provide more efficient ...