US Patent Issued to Apple on Aug. 4 for "Semiconductor package with local interconnect and chiplet integration" (California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,028, issued on Aug. 4, was assigned to Apple Inc. (Cupertino, Calif.).

"Semiconductor package with local interconnect and chiplet integration" was invented by Sanjay Dabral (Cupertino, Calif.), Jun Zhai (Cupertino, Calif.), Kunzhong Hu (Cupertino, Calif.), SivaChandra Jangam (Milpitas, Calif.) and Zhitao Cao (Campbell, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor packages including local interconnects and methods of fabrication are described. In an embodiment, a local interconnect is fabricated with one or more cavities filled with a low-k material or air gap where a die-to-die routing path electrically connecting the first die...