US Patent Issued to APAQ TECHNOLOGY on Sept. 15 for "Mobile device and wound capacitor package structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,422, issued on Sept. 15, was assigned to APAQ TECHNOLOGY Co. LTD. (Taiwan, China).

"Mobile device and wound capacitor package structure thereof" was invented by Chung-Jui Su (Kaohsiung City, Taiwan) and Ming-Tsung Liang (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mobile device and a wound capacitor package structure thereof are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly and a packaging assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The packaging assembly includes a filling body for completely encapsulating the wound as...