US Patent Issued to AOI ELECTRONICS on Nov. 3 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,472, issued on Nov. 3, was assigned to AOI ELECTRONICS Co. LTD. (Kagawa, Japan).

"Semiconductor device and method of manufacturing the same" was invented by Atsushi Kuroha (Kagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The increase in manufacturing cost is suppressed and reliability of a semiconductor device is improved. A semiconductor device 1 includes a light emitting element 2, a light receiving element 3, and a die pad 20 made of a conductive material. The die pad 20 includes a first region 20A and a second region 20B having a thickness greater than that of the first region 20A. The light receiving element 3 is provided on an uppe...