US Patent Issued to Ansys on March 3 for "Prediction of steady state heat maps for chip thermal analysis" (California, Massachusetts, New Hampshire, Pennsylvania Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,909, issued on March 3, was assigned to Ansys Inc. (Canonsburg, Pa.).

"Prediction of steady state heat maps for chip thermal analysis" was invented by Mehdi Abarham (Belmont, Calif.), Saeed Asgari (Westborough, Mass.), Jimin Wen (Pleasanton, Calif.), Norman Chang (Fremont, Calif.), David Geb (Walnut Creek, Calif.), Viralkumar Girishchandra Gandhi (Nashua, N.H.), Hsiming Pan (San Jose, Calif.), Akhilesh Kumar (Milpitas, Calif.) and Haiyang He (Washington, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and apparatus of a device of predicting a heat map for a die model is described. In an exemplary embodiment, the device receives a die mod...