US Patent Issued to ANSYS on March 17 for "Steady-state IC thermal analysis with thermal decay curve characterization" (California, Massachusetts, New Hampshire, Pennsylvania Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,913, issued on March 17, was assigned to ANSYS INC. (Canonsburg, Pa.).

"Steady-state IC thermal analysis with thermal decay curve characterization" was invented by Jimin Wen (Pleasanton, Calif.), Hsiming Pan (San Jose, Calif.), Norman Chang (Fremont, Calif.), Haiyang He (Washington, Pa.), Mehdi Abarham (Belmont, Calif.), Akhilesh Kumar (Milpitas, Calif.), David Geb (Walnut Creek, Calif.), Saeed Asgari (Westborough, Mass.), Zhigang Feng (San Jose, Calif.), Wenbo Xia (Milpitas, Calif.) and Viralkumar Girishchandra Gandhi (Nashua, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for improved simulation of thermal characterizatio...