US Patent Issued to Anji Microelectronics Technology (Shanghai) on June 16 for "Chemical mechanical polishing solution" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,319, issued on June 16, was assigned to Anji Microelectronics Technology (Shanghai) Co. Ltd. (Shanghai).

"Chemical mechanical polishing solution" was invented by Xiaoming Ren (Shanghai), Changzheng Jia (Shanghai) and Shoutian Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a chemical mechanical polishing solution containing cerium oxide, polyacrylic acid, polyvinyl amine and water. In this invention polyvinyl amine can serve as an additive to reduce the dishing amount of patterned wafer by negatively charged cerium oxide, and improve the efficiency of planarization."

The patent was filed on Dec. 3, 2020, under Application N...