US Patent Issued to Analog Devices on Nov. 3 for "Integrated electronic module with laminated bridge assembly" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,822, issued on Nov. 3, was assigned to Analog Devices Inc. (Wilmington, Mass.).

"Integrated electronic module with laminated bridge assembly" was invented by Hien Minh Pham (Fremont, Calif.) and Melvin Sto Domingo Nava (Morgan Hill, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated electronic module assembly may include a substrate comprising conductive regions on opposite surfaces of the substrate and a laminated bridge assembly. The laminated bridge assembly may include a dielectric material, the dielectric material forming a planar region and respective legs defining a cavity region, the respective legs including at least one res...