US Patent Issued to Analog Devices International UnLtd. on Aug. 25 for "Integrated curcuit to dielectric substrate transition" (American, Turkish Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,171, issued on Aug. 25, was assigned to Analog Devices International UnLtd. Co. (Limerick, Ireland).

"Integrated curcuit to dielectric substrate transition" was invented by Fatih Kocer (Boxboro, Mass.), Christoph Maximilian Steinbrecher (Pennington, N.J.), Sacid Oruc (Yenimahalle, Turkey), Ekrem Oran (Hollis, N.H.), Santosh Anil Kudtarkar (Ayer, Mass.) and Arun Raj (Woburn, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package may include an integrated circuit die mounted on a package substrate, the package substrate may include a dielectric medium, the integrated circuit die may include respective electrical interconnect...