US Patent Issued to AMOSENSE on Sept. 8 for "Power module including multiple layers having varied coefficients of thermal expansion and thermal conductivities" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,495, issued on Sept. 8, was assigned to AMOSENSE Co. LTD. (Cheonan-si, South Korea).

"Power module including multiple layers having varied coefficients of thermal expansion and thermal conductivities" was invented by Jihyung Lee (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a power module and a manufacturing method therefor, the power module comprising: a base plate having recessed grooves formed on the upper surface thereof; brazing filler layers arranged in the recessed grooves; and a ceramic substrate brazed to the upper surface of the base plate by means of the brazing filler layers. The...