US Patent Issued to AMOSENSE on June 16 for "Adhesive transfer film and method for manufacturing power module substrate by using same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,323, issued on June 16, was assigned to AMOSENSE Co. LTD. (Cheonan-si, South Korea).

"Adhesive transfer film and method for manufacturing power module substrate by using same" was invented by Younghwan Jun (Cheonan-si, South Korea), Kyungwhan Woo (Cheonan-si, South Korea) and Yongsul Song (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing an Ag sintering paste in the form of a film....