US Patent Issued to Amkor Technology Singapore Holding on Sept. 8 for "Electronic devices having embedded module and methods of manufacturing electronic devices having the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,535, issued on Sept. 8, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Electronic devices having embedded module and methods of manufacturing electronic devices having the same" was invented by Dae Young Park (Jeollanam-do, South Korea), Byong Jin Kim (Seoul, South Korea), Gi Jeong Kim (Gyeonggi-do, South Korea), Hyeong Il Jeon (Gyeonggi-do, South Korea), Kwang Soo Sang (Incheon, South Korea) and Jin Young Khim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module sub...