US Patent Issued to AMKOR TECHNOLOGY SINGAPORE HOLDING on March 24 for "Semiconductor package and fabricating method thereof" (South Korean, American Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,560, issued on March 24, was assigned to AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD. (Singapore).

"Semiconductor package and fabricating method thereof" was invented by David Hiner (Chandler, Ariz.), Michael Kelly (Queen Creek, Ariz.), Ronald Huemoeller (Gilbert, Ariz.), In Su Mok (Gyeonggi-do, South Korea), Sang Hyoun Lee (Incheon, South Korea), Won Chul Do (Seoul, South Korea), Jin Young Khim (Seoul, South Korea), Gam Han Yong (Incheon, South Korea), Min Su Jeong (Incheon, South Korea) and Ji Hun Lee (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure and a method for making a semiconductor p...