US Patent Issued to AMD DESIGN on Nov. 3 for "Heat sink with heat pipe handle portion" (New Jersey, Washington Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,766, issued on Nov. 3, was assigned to AMD DESIGN LLC (Wilmington, Del.).

"Heat sink with heat pipe handle portion" was invented by Sruti Chigullapalli (Seattle), Atharva Rahane (Jersey City, N.J.), Nicholas Keator (Lincoln Park, N.J.) and David Liang (West Orange, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat sink is provided that includes a plurality of heat sinks and a plurality of fins in a stacked configuration. The heat pipes are operable to receive and transfer heat away from a computing component. The fins form a central aperture extending along a vertical axis. At least one of the heat pipes includes a handle portion operable to...