US Patent Issued to Amazon Technologies on May 19 for "Composite software bill of materials analysis" (American, Canadian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,632,241, issued on May 19, was assigned to Amazon Technologies Inc. (Seattle).

"Composite software bill of materials analysis" was invented by Roland Mesde (Sunnyvale, Calif.), George Sherif Kamal Hanna (Toronto), Nitin Giri (Bothell, Wash.), Michael Kenneth Dosenbach (Renton, Wash.), Prasad Vyawahare (Redmond, Wash.), Ziad Elmalki (Livermore, Calif.), Sean Crutchlow (San Jose, Calif.), Seungjin Lee (Seattle) and Paul Mangiamele (Brisbane, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A software bill of materials management and analysis service generates a data structure for analytical operations using a composite software bill of materials (comp...