US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on March 3 for "Chip scale semiconductor package having back side metal layer and raised front side pad and method of making the same" (American, Chinese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,845, issued on March 3, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto).

"Chip scale semiconductor package having back side metal layer and raised front side pad and method of making the same" was invented by Yan Xun Xue (Los Gatos, Calif.), Madhur Bobde (Sunnyvale, Calif.), Long-Ching Wang (Cupertino, Calif.), Zhiqiang Niu (Santa Clara, Calif.) and Lin Lv (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip scale semiconductor package comprises a silicon layer, a back side metal layer, and a plurality of front side pads. Each of the plurality of front side pads comprises a respective copper member and a respectiv...