US Patent Issued to Allegro MicroSystems on May 26 for "Packaged current sensor integrated circuit with exposed cooling pad" (German, American Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,009, issued on May 26, was assigned to Allegro MicroSystems LLC (Manchester, N.H.).

"Packaged current sensor integrated circuit with exposed cooling pad" was invented by Emil Pavlov (Heidelberg, Germany), Ahmad Nour Halawani (Heidelberg, Germany) and William P. Taylor (Amherst, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A current sensor integrated circuit package includes a primary conductor having an input portion into which a current flows and an output portion from which the current flows, a plurality of secondary leads, and a semiconductor die disposed adjacent to a top surface of the primary conductor and positioned on an insulator port...