US Patent Issued to Allegro MicroSystems on June 30 for "Integrated circuit packaging with insulation structure to control gap height and die tilt" (Massachusetts, New Hampshire Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,592, issued on June 30, was assigned to Allegro MicroSystems LLC (Manchester, N.H.).

"Integrated circuit packaging with insulation structure to control gap height and die tilt" was invented by David Youm (Malden, Mass.), Weidong Wang (Westford, Mass.) and Natasha Healey (Manchester, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A current sensor integrated circuit (IC) package includes an insulation structure disposed between a semiconductor die and a lead frame to control gap height and prevent the die from tilting and dropping the magnetic field coupling between the die the primary conductor. An insulation structure is disposed between the di...