US Patent Issued to Allegro MicroSystems on July 14 for "Multi-die integrated circuit device with a spark gap" (New Hampshire, Massachusetts, Florida Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,188, issued on July 14, was assigned to Allegro MicroSystems LLC (Manchester, N.H.).

"Multi-die integrated circuit device with a spark gap" was invented by Washington Lamar (Mont Vernon, N.H.), Weidong Wang (Westford, Mass.), Maxim Klebanov (Palm Coast, Fla.), Sagar Saxena (Manchester, N.H.) and Yash Shaileshbhai Patel (Manchester, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package having more than one semiconductor die includes a spark gap to provide a current path designed to protect the device. The spark gap can be provided between an exposed portion of a corner lead and an exposed portion of a tie bar and/or betwee...