ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,291, issued on May 19, was assigned to ALEDIA (Echirolles, France).
"Method for local removal of semiconductor wires" was invented by Pierre Tchoulfian (Grenoble, France), Pamela Rueda Fonseca (Fontaine, France) and Wei Sin Tan (Grenoble, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for local removal of semiconductor wires (SW) including the following steps: -Provide a stack of layers including at least a substrate, a nucleation layer, a growth masking layer, and a layer including SW being grown from the nucleation layer through the growth masking layer, -Encapsulate the SW with an encapsulation layer so as to form a composite layer...