US Patent Issued to AIPhotonics on May 12 for "Apparatus and method for quantifying the surface flatness of three-dimensional point cloud data" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,942, issued on May 12, was assigned to AIPhotonics Ltd. (Hong Kong, Hong Kong).

"Apparatus and method for quantifying the surface flatness of three-dimensional point cloud data" was invented by Hok Chuen Cheng (Hong Kong, Hong Kong), Chun Hei Chan (Hong Kong, Hong Kong), Wang Kong Lam (Hong Kong, Hong Kong), Winston Sun (Hong Kong, Hong Kong) and Kei Hin Ng (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method that quantifies the surface flatness of 3D point cloud data in which a test statistic is proposed to indicate the surface flatness based on the threshold of the allowed bump level, the confidence level of test statistics...