US Patent Issued to AGC on March 17 for "Carrier substrate, laminate, and method for manufacturing electronic device" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,730, issued on March 17, was assigned to AGC INC. (Tokyo).

"Carrier substrate, laminate, and method for manufacturing electronic device" was invented by Kazutaka Ono (Tokyo), Takatoshi Yaoita (Tokyo), Reo Usui (Tokyo), Kenichi Ebata (Tokyo) and Jun Akiyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate ...