ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,386, issued on June 23, was assigned to AGC Inc. (Tokyo) and AGC SI-TECH Co. LTD. (Kitakyushu, Japan).
"Hollow silica particles and method for producing the same" was invented by Hiromichi Kamo (Tokyo), Masashi Kondo (Tokyo) and Hajime Katayama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to hollow silica particles, which each includes a shell layer containing silica and a space inside the shell layer, in which the hollow silica particles have a peak intensity derived from SiOH at a wavenumber of around 3,746 cm-1 of 0.60 or less by infrared spectroscopy, a relative permittivity at 1 GHz of from 1.3 to 5.0 and ...