US Patent Issued to Advanced Semiconductor Engineering on Sept. 8 for "Semiconductor device package and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,503, issued on Sept. 8, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Semiconductor device package and method for manufacturing the same" was invented by Zheng Wei Wu (Kaohsiung, Taiwan) and Cheng Kai Chang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface, an electrical contact disposed over a first region of the substrate, and an EMI shielding layer disposed over the substrate. The EMI shielding layer includes a non-uniform thickness and an elevation of the EMI ...