US Patent Issued to Advanced Semiconductor Engineering on Oct. 27 for "Electronic package" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,950, issued on Oct. 27, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Electronic package" was invented by Pin-Yao Chen (Kaohsiung, Taiwan), Shiuan-Yu Lin (Kaohsiung, Taiwan) and Hung-Jung Tu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package includes a pad, a dielectric layer, a bump, and a conductive element. The dielectric layer encapsulates the pad and includes an opening exposing the pad. The bump is disposed over the pad. The conductive element is disposed in the opening between the pad and the bump. The conductive element is configured to mitigate a shrinkage of an electrical...