US Patent Issued to Advanced Semiconductor Engineering on Nov. 3 for "Semiconductor package" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,866, issued on Nov. 3, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Semiconductor package" was invented by Ying-Chung Chen (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a lid structure are disclosed. The semiconductor package includes a carrier, a lid structure, a first die, and a second die. The lid structure is disposed over the carrier and includes a gas inlet and a gas outlet. The first die is disposed over the carrier. The second die is disposed over the carrier. The lid structure includes a first protrusion pattern protruding toward the carrier and extending betwee...