US Patent Issued to Advanced Semiconductor Engineering on May 12 for "Package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,353, issued on May 12, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Package structure" was invented by Hai-Ming Chen (Kaohsiung, Taiwan), Hung-Yi Lin (Kaohsiung, Taiwan) and Cheng-Yuan Kung (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a semiconductor substrate. The semiconductor substrate includes a lower portion and an upper portion. The upper portion of the semiconductor substrate defines a high speed signal transmission region. The high speed signal transmission region includes a first region configured to communicate with a first ...